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plays, light modulators, switches, gas chromatographs, etc, are some of the many devices that appeared in that period Some of these pioneering works are described in Trimmer (1990) An excellent review article (Petersen, 1982) also has a good description of the early applications of MEMS and the manufacturing techniques used to make them Today, commercial applications of MEMS are in inertial measurement devices such as accelerometers and gyroscopes; microoptical devices such as displays; telecommunication devices such as mechanical lters, aligners, and switches; micro uidic devices such as valves, pumps, owchannels for biochemical lab-on-a-chip devices, and ink-jet printer heads, to name a few Many other applications have emerged and are likely to enter the commercial market in the near future From a mechanical perspective, the principle of operation of most MEMS devices is rather simple For example, a micromechanical accelerometer consists of an inertial mass suspended with an elastic structure It can be as simple as a cantilever with a mass attached to its free end The movement of the mass is measured by one of a variety of means and is used to estimate the acceleration of the body on which the device is mounted A typical MEMS pressure sensor consists of a membrane that de ects in response to increased pressure Its deformation is measured using a transduction technique to estimate the pressure The same membrane when actuated in a controlled manner can be used as a pump A system of vibrating masses attached to each other with beams serves as a mechanical lter Flat structures attached to beams that twist act as micromechanical mirrors used in projection displays The majority of MEMS devices developed until now use very simple mechanical structures (beams, membranes, and plates) that elastically deform Thus, the signi cance of such devices lies not in their mechanical structure but in the transduction scheme based on physical, chemical, and biochemical phenomena and of course micromachining A sourcebook on micromachined transducers (Kovacs, 1998) describes them comprehensively In contrast, the emphasis in this chapter is on those MEMS devices in which there is relative motion and motion and force transmission among rigid bodies with intermittent or sustained contact Whether elastic deformation is used or rigid-body motion is used, materials and the processing techniques play a crucial role in the development of MEMS These two are discussed in the following two sections.

public CountDown(int n) { val = n; } // } } class AliasQualifierDemo { static void Main() { // Here, the :: operator // tells the compiler to use the CountDown // that is in the Counter namespace Ctr::CountDown cd1 = new Ctr::CountDown(10); // } }

Whereas a standard report may give you an overview of what is going on, multidimensional analysis helps you uncover why, when, and where Use the drill functionality to explore data by additional levels of detail and different dimensions Use the Drill bar to navigate different dimensions and select different members within a hierarchy As you explore the data, you may find that you need additional details not within the microcube Use Drill Through to retrieve additional information from the data source and re-execute the entire query Finally, use the discussion capability within InfoView to share the results of your analyses with other users

In this version, the alias Ctr is specified for Counter by the following line:

using Ctr = Counter;

Silicon has turned out to be an excellent mechanical material, and it has played a key role in the development of MEMS technology so far A number of other materials are also appearing in MEMS devices The choice of a material depends largely on the fabrication technology used to make MEMS devices In this respect, the development of MEMS materials and fabrication processes can be divided into four phases (NRC, 1997) The rst phase consisted of the early years (1965 to 1985) when old materials and old processes of microelectronics were used to make MEMS devices These materials were silicon, oxide and nitride, quartz, and some metals The processes were deposition and photolithography-based etching of thin lms In the second phase, microelectronic processes were developed further into new micromachining processes but still used the old materials The new processes include a sacri cial layer that enable the fabrication of releasable structures, bulk etching techniques that can also create releasable structures, some wafer-bonding techniques, and deep lithography and micromolding techniques The third phase used new materials such as polymers, ceramics, metals, and some active materials but processed them with existing old techniques The fourth phase will be to develop new processes for these new materials The MEMS eld is now in the third phase